Editorial Board

Editor-in-Chief

Sherman Shen, Univ. of Waterloo, Canada
Email: sshen@uwaterloo.ca


Associate Editor-in-Chief

Nei Kato, Tohoku University, Japan
Email: kato@it.ecei.tohoku.ac.jp

Associate Editor-in-Chief

​​Honggang Wang, UMass-Dartmouth, USA
Email: hwang1@umassd.edu

Founding Editor-in-Chief (2014-2016)

Chonggang Wang, InterDigital, USA
Email: cgwang@ieee.org

​Editorial Board

Area 1: Sensors and Devices for IoT

​ Chenyang Lu (Area Editor)
Washington University in St. Louis, USA

​Paul C.-P. Chao (Area Editor)
​National Chiao Tung University, Taiwan

Luigi Atzori
University of Cagliari, Italy
Sasitharan Balasubramaniam
Tampere Univ of Tech, Finland
Igor Bisio
University of Genoa, Italy
Tian He
University of Minnesota, USA
Ping-Hsuan Hsieh
National Tsing Hua University, Taiwan

Rose Hu
Utah State University, USA
Roozbeh Jafari
Univ of Texas at Dallas, USA
Minho Jo
Korea University, Korea
Samir Kapoor
Qualcomm, USA
Kristof Van Laerhoven
TU Darmstadt, Germany

Yunhao Liu
Tsinghua University, China
Jin Mitsugi
Keio University, Japan
Huansheng Ning
Univ of Sci & Tech Beijing, China
Ronald Williams
University of Virginia, USA

​Area 2: Communications and Networking for IoT

Baochun Li (Area Editor)
​University of Toronto, Canada

Andrea Zanella (Area Editor)
​University of Padova, Italy

Nirwan Ansari
New Jersey Institute of Technology, USA
Shanzhi Chen
China Academy of Telecom Tech, China
Kaushik Chowdhury
Northeastern University, USA
Zubair Fadlullah
Tohoku University, Japan
Liljana Gavrilovska
Univ. Sts. Cyril and Methodius, Macedonia
Snagtae Ha
University of Colorado at Boulder, USA
Rittwik Jana
AT&T Labs Research, USA
Tao Jiang
Huazhong Univ of Science and Tech, China
Latif Ladid
IPv6 Forum/SnT UL, Luxemburg
Sung-Ju Lee
KAIST, Korea

Jie Li
University of Tsukuba, Japan
Phone Lin
National Taiwan University, Taiwan
Jiangchuan Liu
Simon Fraser University, Canada
Kejie Lu
Univ of Puerto Rico at Mayagüez, Puerto Rico
Hassnaa Moustafa
Intel, USA
Mugen Peng
BUPT, China
Joachim Sachs
Ericsson, Sweden
Stefania Sesia
Intel, France
Tarik Taleb
Aalto University, Finland
Yu-Chee Tseng
National Chiao Tung University, Taiwan

​Hung-Yu Wei
National Taiwan University, Taiwan
Yonggang Wen
Nanyang Technological University, Singapore
Hongyi Wu
University of Louisiana at Lafayette, USA
Ke Xu
Tsinghua University, China
Hongfang Yu
UESTC, China
Yan Zhang
University of Oslo, Norway
Rui Zhang
​University of Hawaii, USA
Tao Zhang
Cisco Systems Inc., USA
Weiyi Zhang
AT&T Labs Research, USA


​Area 3: Services and Applications for IoT

Shiwen Mao (Area Editor)
Auburn University, USA

Mehmet Ulema (Area Editor)
Manhattan College, USA

Payam Barnaghi
University of Surrey, UK
Xiaowen Chu
Hong Kong Baptist University, China
Hua Fang
Univ. of Massachusetts Medical School, USA
Andrei Gurtov
Aalto University, Helsinki
Haibo He
University of Rhode Island, USA
Xiaohua Jia
City University of Hong Kong, HongKong
Javier Lopez
University of Malaga, Spain
Jinhu Lu
Chinese Academy of Sciences, China
Reza Malekian
University of Pretoria, South Africa
Hong Mei
Beijing University, China

Chunyan Miao
Nanyang Technological University, Singapore
Enzo Mingozzi
University of Pisa, Italy
Shahid Mumtaz
Instituto de Telecom Aveiro, Portugal
Miao Pan
University of Houston, USA
Manish Parashar
Rutgers University, USA
Yi Qian
University of Nebraska-Lincoln, USA
Shahid Raza
SICS, Sweden
Kui Ren
SUNY Buffalo, USA
Joel J. P. C. Rodrigues
University of Beira Interior, Portugal
Pierangela Samarati
University of Milan, Italy

Wenzhan Song
University of Georgia, USA
Jian Tang
Syracuse University, USA
Junfeng Wang
Sichuan University, China
Shaoen Wu
Ball State University, USA
Zheng Yan
XiDian University, China
Kai Yang
Huawei, USA
Shui Yu
Deakin University, Australia
Gang Zhou
College of William and Mary, USA
Haojin Zhu
Shanghai Jiao Tong University, China

​Advisory Board

Victor Bahl
Microsoft Research, USA
David Belanger
Stevens Institute of Technology, USA
Hsiao-Hwa Chen
National Cheng Kung Univ., Taiwan
Wen Gao
Beijing University, China
Mohsen Guizani
University of Idaho, USA
Sumi Helal
University of Florida, USA

Jinpeng Huai
​Beihang University, China
P. R. Kumar
Texas A&M University, USA
Jaiyong Lee
Yonsei University, Korea
Bo Li
HKUST, HongKong, China
​Yanbing Liu
CQUPT, China
Roberto Minerva
Telecom Italia, Italy

Vincenzo Piuri
University of Milan, Italy
H. Vincent Poor

Princeton University, USA
Weisong Shi
Wayne State University, USA
Kazem Sohraby
South Dakota School of Mines and Tech, USA
John Stankovic
University of Virginia, USA
Jianping Wu
​Tsinghua University, China